The DA14531 SmartBond TINYTM Module isbased on DA14531 SoC bluetooth Low energy module designed by Dialog Semiconductor. The module is designed to enable the use of Bluetooth Low Energy in applications where Bluetooth Low Energy could not be used until now because of cost or complexity. The bigger picture is to drive Bluetooth Low Energy technology into every application, turning every product into a connected IoT node to drive the next 1 billion IoT devices in the market. The SmartBond TINYTM Module is supported by software that is easy to work with. This lowers the threshold to use Bluetooth Low Energy technology and significantly speeds up the design time. The module comes with a configurable DSPS (serial port service) and next generation Codeless software to design Bluetooth applications without Bluetooth knowledge or advanced programming skills.
Key Features

Bluetooth

Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC
CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core
Supports up to 3 connections
Dialog Semiconductor registered BD address preprogrammed in OTP

Processing and memories

16 MHz 32-bit Arm Cortex M0+ with SWD interface
128 Kbytes internal FLASH
48 Kbytes RAM
144 Kbytes ROM
32 Kbytes OTP

Current Consumption

2 mA RX at VBAT=3V
4 mA TX at VBAT=3V and 0 dBm
1.8 A at sleep with all RAM retained

Radio

Programmable RF transmit power from -19 to +2.2 dBm
-93 dBm receiver sensitivity

Interfaces

Quadrature decoder with 3 channels
3 channel 11-bit ENOB ADC
2 general purpose timers with PWM
9 GPIOs
SPI
2x UART, 1-wire UART support
I2C

Power Management

Operating range (1.8 V – 3.3 V)
Inrush current control

Other

Real Time Clock
Trimmed 32 MHz Crystal

Packaging

12.5 mm x 14.5 mm x 2.8 mm package

Resources

DA14531 SmartBond Tiny Module Product Brief
DA14531 Module Datasheet